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    Convective Cooling of Compact Electronic Devices Via Liquid Metals With Low Melting Points

    Source: Journal of Heat Transfer:;2021:;volume( 143 ):;issue: 005::page 050801-1
    Author:
    Liu, Gui Lin
    ,
    Liu, Jing
    DOI: 10.1115/1.4050404
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, convective liquid metal cooling provides considerably high performance due to its unique thermal properties. This paper first reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.
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      Convective Cooling of Compact Electronic Devices Via Liquid Metals With Low Melting Points

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    contributor authorLiu, Gui Lin
    contributor authorLiu, Jing
    date accessioned2022-02-06T05:33:15Z
    date available2022-02-06T05:33:15Z
    date copyright4/1/2021 12:00:00 AM
    date issued2021
    identifier issn0022-1481
    identifier otherht_143_05_050801.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4278268
    description abstractThe increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, convective liquid metal cooling provides considerably high performance due to its unique thermal properties. This paper first reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleConvective Cooling of Compact Electronic Devices Via Liquid Metals With Low Melting Points
    typeJournal Paper
    journal volume143
    journal issue5
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4050404
    journal fristpage050801-1
    journal lastpage050801-17
    page17
    treeJournal of Heat Transfer:;2021:;volume( 143 ):;issue: 005
    contenttypeFulltext
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