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contributor authorSingh, Maibam Romio
contributor authorGiri, Asis
date accessioned2022-02-05T22:05:24Z
date available2022-02-05T22:05:24Z
date copyright3/5/2021 12:00:00 AM
date issued2021
identifier issn1948-5085
identifier othertsea_13_4_041027.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4276887
description abstractThis experimental study explores the passive cooling of electronic devices using phase change materials (PCM). Pin fin configurations made of aluminum are considered as thermal conductive enhancers and eicosane as the PCM for the study. The experiment considers four different heat sinks, with 40 and 56 numbers of pin fins. For the same number of pin fin, dual and constant height fin arrangements are study. The volume fractions of TCEs are 9%, 11%, 13%, and 16%. Apart from these heat sinks, a heat sink with no fin (blank heat sink) is considered for baseline comparison. Five different heat fluxes are considered (ranging from 1.17 kW/m2 to 2.35 kW/m2). The effect of number of fins, type of fins, and volumes of PCM has been reviewed. It has been observed that the introduction of fins enhances the heat transfer. An elongation in operational time is achieved in the case of dual height heat sinks compared to constant height heat sink filled with PCM. All the experiments are performed in a temperature-controlled room to avoid environment fluctuation.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Comparison of the Performance of Constant and Dual Height Pin Fins in Phase Change Material Cooling Technique
typeJournal Paper
journal volume13
journal issue4
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4048665
journal fristpage041027-1
journal lastpage041027-11
page11
treeJournal of Thermal Science and Engineering Applications:;2021:;volume( 013 ):;issue: 004
contenttypeFulltext


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