contributor author | Jessee, Alex | |
contributor author | Peddada, Satya R. T. | |
contributor author | Lohan, Danny J. | |
contributor author | Allison, James T. | |
contributor author | James, Kai A. | |
date accessioned | 2022-02-04T22:13:32Z | |
date available | 2022-02-04T22:13:32Z | |
date copyright | 5/21/2020 12:00:00 AM | |
date issued | 2020 | |
identifier issn | 1050-0472 | |
identifier other | md_142_11_111702.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4275132 | |
description abstract | A new method for optimizing the layout of device-routing systems is presented. Gradient-based topology optimization techniques are used to simultaneously optimize both device locations and routing paths of device interconnects. In addition to geometric considerations, this method supports optimization based on system behavior by including physics-based objectives and constraints. Multiple physics domains are modeled using lumped parameter and finite element models. A geometric projection for devices of arbitrary polygonal shape is developed along with sensitivity analysis. Two thermal-fluid systems are optimized to demonstrate the use of this method. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Simultaneous Packing and Routing Optimization Using Geometric Projection | |
type | Journal Paper | |
journal volume | 142 | |
journal issue | 11 | |
journal title | Journal of Mechanical Design | |
identifier doi | 10.1115/1.4046809 | |
journal fristpage | 0111702-1 | |
journal lastpage | 0111702-14 | |
page | 14 | |
tree | Journal of Mechanical Design:;2020:;volume( 142 ):;issue: 011 | |
contenttype | Fulltext | |