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    Simultaneous Packing and Routing Optimization Using Geometric Projection

    Source: Journal of Mechanical Design:;2020:;volume( 142 ):;issue: 011::page 0111702-1
    Author:
    Jessee, Alex
    ,
    Peddada, Satya R. T.
    ,
    Lohan, Danny J.
    ,
    Allison, James T.
    ,
    James, Kai A.
    DOI: 10.1115/1.4046809
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A new method for optimizing the layout of device-routing systems is presented. Gradient-based topology optimization techniques are used to simultaneously optimize both device locations and routing paths of device interconnects. In addition to geometric considerations, this method supports optimization based on system behavior by including physics-based objectives and constraints. Multiple physics domains are modeled using lumped parameter and finite element models. A geometric projection for devices of arbitrary polygonal shape is developed along with sensitivity analysis. Two thermal-fluid systems are optimized to demonstrate the use of this method.
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      Simultaneous Packing and Routing Optimization Using Geometric Projection

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4275132
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    contributor authorJessee, Alex
    contributor authorPeddada, Satya R. T.
    contributor authorLohan, Danny J.
    contributor authorAllison, James T.
    contributor authorJames, Kai A.
    date accessioned2022-02-04T22:13:32Z
    date available2022-02-04T22:13:32Z
    date copyright5/21/2020 12:00:00 AM
    date issued2020
    identifier issn1050-0472
    identifier othermd_142_11_111702.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4275132
    description abstractA new method for optimizing the layout of device-routing systems is presented. Gradient-based topology optimization techniques are used to simultaneously optimize both device locations and routing paths of device interconnects. In addition to geometric considerations, this method supports optimization based on system behavior by including physics-based objectives and constraints. Multiple physics domains are modeled using lumped parameter and finite element models. A geometric projection for devices of arbitrary polygonal shape is developed along with sensitivity analysis. Two thermal-fluid systems are optimized to demonstrate the use of this method.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSimultaneous Packing and Routing Optimization Using Geometric Projection
    typeJournal Paper
    journal volume142
    journal issue11
    journal titleJournal of Mechanical Design
    identifier doi10.1115/1.4046809
    journal fristpage0111702-1
    journal lastpage0111702-14
    page14
    treeJournal of Mechanical Design:;2020:;volume( 142 ):;issue: 011
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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