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    Packaging Environmental Sensors for Monitoring Urban-Microclimates

    Source: ASME Journal of Engineering for Sustainable Buildings and Cities:;2020:;volume( 001 ):;issue: 003::page 031001-1
    Author:
    Dey, Shuv
    ,
    Michael Brown, J.
    ,
    Joshi, Yogendra
    DOI: 10.1115/1.4047422
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An internet-of-things (IoT)-based low-cost sensor network can be used to collect the data necessary to study both Urban Heat Island (UHI) and air pollution. There are several key challenges associated with an IoT-based solution to environmental data monitoring, including packaging and deployment. This study explores these challenges by looking at effects the packaging has on the deployed environmental sensors. Several packaging designs are numerically studied using a computation fluid dynamics (CFD) model. Two sensor designs are chosen using results obtained from CFD modeling and then experimentally deployed. The findings conclude that the IoT sensors chosen for this study are not significantly affected by flow velocities or require advanced packaging designs when paired with street-side outdoor digital displays.
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      Packaging Environmental Sensors for Monitoring Urban-Microclimates

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4275032
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    • ASME Journal of Engineering for Sustainable Buildings and Cities

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    contributor authorDey, Shuv
    contributor authorMichael Brown, J.
    contributor authorJoshi, Yogendra
    date accessioned2022-02-04T22:10:43Z
    date available2022-02-04T22:10:43Z
    date copyright6/18/2020 12:00:00 AM
    date issued2020
    identifier issn2642-6641
    identifier otherjesbc_1_3_031001.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4275032
    description abstractAn internet-of-things (IoT)-based low-cost sensor network can be used to collect the data necessary to study both Urban Heat Island (UHI) and air pollution. There are several key challenges associated with an IoT-based solution to environmental data monitoring, including packaging and deployment. This study explores these challenges by looking at effects the packaging has on the deployed environmental sensors. Several packaging designs are numerically studied using a computation fluid dynamics (CFD) model. Two sensor designs are chosen using results obtained from CFD modeling and then experimentally deployed. The findings conclude that the IoT sensors chosen for this study are not significantly affected by flow velocities or require advanced packaging designs when paired with street-side outdoor digital displays.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePackaging Environmental Sensors for Monitoring Urban-Microclimates
    typeJournal Paper
    journal volume1
    journal issue3
    journal titleASME Journal of Engineering for Sustainable Buildings and Cities
    identifier doi10.1115/1.4047422
    journal fristpage031001-1
    journal lastpage031001-9
    page9
    treeASME Journal of Engineering for Sustainable Buildings and Cities:;2020:;volume( 001 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian