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    Condensation and Wetting Behavior on Hybrid Superhydrophobic and Superhydrophilic Copper Surfaces

    Source: Journal of Heat Transfer:;2020:;volume( 142 ):;issue: 004
    Author:
    Wang, Hai
    ,
    Nguyen, Quang
    ,
    Kwon, Jae W.
    ,
    Ma, Hongbin
    DOI: 10.1115/1.4046209
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A novel hybrid superhydrophobic and superhydrophilic copper surface was fabricated using a lift-off process to integrate the benefits of dropwise and filmwise condensation together. The superhydrophilic surface was comprised of microflower like CuO and nanorod Cu(OH)2 with a diameter in the range of 200–600 nm and the superhydrophobic surface was fabricated by chemical modification with Cytop on the hierarchically structured surface of CuO/Cu(OH)2. Wetting condition effect on the hybrid surface was investigated experimentally with a high-speed camera attached to a microscope and an environmental scanning electrical microscope (ESEM). Out-of-plane droplet jumping motion on superhydrophilic region and gravity effect on the droplet motion were examined. Experiment results showed that effective heat transfer coefficients of hybrid superhydrophobic and superhydrophilic surfaces were improved as compared with those of pure superhydrophobic surface. Comparison results between two hybrid surfaces with 2 and 4 mm pattern pitches indicated that the distance reduction between two neighboring superhydrophilic areas can enhance the condensation performance because short distance can promote the microcondensate coalescence and droplets removal.
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      Condensation and Wetting Behavior on Hybrid Superhydrophobic and Superhydrophilic Copper Surfaces

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4274244
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    contributor authorWang, Hai
    contributor authorNguyen, Quang
    contributor authorKwon, Jae W.
    contributor authorMa, Hongbin
    date accessioned2022-02-04T14:43:30Z
    date available2022-02-04T14:43:30Z
    date copyright2020/02/20/
    date issued2020
    identifier issn0022-1481
    identifier otherht_142_04_041601.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4274244
    description abstractA novel hybrid superhydrophobic and superhydrophilic copper surface was fabricated using a lift-off process to integrate the benefits of dropwise and filmwise condensation together. The superhydrophilic surface was comprised of microflower like CuO and nanorod Cu(OH)2 with a diameter in the range of 200–600 nm and the superhydrophobic surface was fabricated by chemical modification with Cytop on the hierarchically structured surface of CuO/Cu(OH)2. Wetting condition effect on the hybrid surface was investigated experimentally with a high-speed camera attached to a microscope and an environmental scanning electrical microscope (ESEM). Out-of-plane droplet jumping motion on superhydrophilic region and gravity effect on the droplet motion were examined. Experiment results showed that effective heat transfer coefficients of hybrid superhydrophobic and superhydrophilic surfaces were improved as compared with those of pure superhydrophobic surface. Comparison results between two hybrid surfaces with 2 and 4 mm pattern pitches indicated that the distance reduction between two neighboring superhydrophilic areas can enhance the condensation performance because short distance can promote the microcondensate coalescence and droplets removal.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCondensation and Wetting Behavior on Hybrid Superhydrophobic and Superhydrophilic Copper Surfaces
    typeJournal Paper
    journal volume142
    journal issue4
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4046209
    page41601
    treeJournal of Heat Transfer:;2020:;volume( 142 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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