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contributor authorAtik, Özgür
contributor authorErtürk, Hakan
date accessioned2019-03-17T09:46:37Z
date available2019-03-17T09:46:37Z
date copyright1/29/2019 12:00:00 AM
date issued2019
identifier issn1948-5085
identifier othertsea_011_03_034501.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4255674
description abstractCooling performance enhancement of computer liquid cooling (LC) systems using hexagonal boron nitride (hBN)–water nanofluids is investigated experimentally. Particle volume fractions of 0.1–2% are considered at constant flow rates varying from 0.3 to 2 L/min for two different cold plates (CPs), with and without fins. A commercial closed-loop LC system is also tested to examine performance of hBN–water nanofluids at constant pumping power. It was observed that the thermal performance can be improved by using hBN nanofluids, and higher improvements are achieved for systems with limited convection rates.
publisherThe American Society of Mechanical Engineers (ASME)
titleEnhancement of Central Processing Unit Liquid Cooling Performance Using Hexagonal Boron Nitride Nanofluids
typeJournal Paper
journal volume11
journal issue3
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4042022
journal fristpage34501
journal lastpage034501-5
treeJournal of Thermal Science and Engineering Applications:;2019:;volume( 011 ):;issue: 003
contenttypeFulltext


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