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contributor authorTan, Xiao-Ming
contributor authorZhang, Jing-Zhou
contributor authorCai, Qing-Zhi
date accessioned2019-03-17T09:43:53Z
date available2019-03-17T09:43:53Z
date copyright1/25/2019 12:00:00 AM
date issued2019
identifier issn1948-5085
identifier othertsea_011_03_031002.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4255648
description abstractExperimental and numerical research is performed to illustrate the effects of pin-fin shapes on mesh-fed slot film cooling performance on a flat-plate model. Three types of pin-fin shapes (such as circular, elliptical, and drop-shaped) with the same cross-sectional area are taken into consideration. The results show that a pair of counter rotating vortices is still generated for the mesh-fed slot film cooling scheme due to the strong “jetting” effect of coolant flow at the slot outlet. As the coolant jet ejecting from mesh-fed slot is capable of establishing more uniform film layer over the protected surface, the kidney vortices are illustrated to have weakly detrimental role on the film cooling performance. By the shaping of pin fins, the uniformity of coolant flow exiting mesh-fed slot is improved in comparison to the baseline case of circular shape, especially for the elliptical-shape pin-fin array. Therefore, the jetting effect of coolant flow is alleviated for the elliptical and drop-shaped pin-fin meshes when compared to the circular pin-fin mesh. In general, the pin-fin shape has nearly no influence on cooling effectiveness immediately downstream the film cooling-hole outlet. However, beyond x/s = 5, the elliptical and drop-shaped pin fins are demonstrated to be advantageous over the circular pin fins.
publisherThe American Society of Mechanical Engineers (ASME)
titleEffects of Pin-Fin Shapes on Mesh-Fed Slot Film Cooling for a Flat-Plate Model
typeJournal Paper
journal volume11
journal issue3
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4041882
journal fristpage31002
journal lastpage031002-11
treeJournal of Thermal Science and Engineering Applications:;2019:;volume( 011 ):;issue: 003
contenttypeFulltext


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