Analytical Model on Lithiation-Induced Interfacial Debonding of an Active Layer From a Rigid Substrate

Abstract

By directly solving the prescribed differential equations, an analytical method based on the cohesive model has been developed to investigate the interfacial debonding process induced by lithiation in an axisymmetric thin film electrode where an elastic active layer is bonded on a rigid substrate. The assumption of rigid substrate has been proved acceptable for high-modulus substrates such as copper and aluminum which are common materials for current collectors in lithium-ion batteries. For the case where the weak interface is assumed and the radial concentration gradient is neglected, an extremely simplified solution has been obtained. The simplified solution which has acceptable accuracy provides a good guidance for understanding and predicting the interfacial debonding.