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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Most solders used in electronic systems have lowmelting temperature and hence experience significant amount of creep deformation throughout their lifecycle because typical operational and test conditions represent high ...