Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN on SiC Semiconductor Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Gallium nitride (GaN) highelectronmobility transistors (HEMTs) dissipate high power densities which generate hotspots and cause thermomechanical problems. Here, we propose and simulate GaNbased HEMT technologies that can ...
Enhanced Heat Transfer Using Microporous Copper Inverse Opals
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance ...