Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wire bond connections are susceptible to fatigue failure as a result of various thermo-mechanical damage mechanisms during the component operation life. Because of uncertainties arising from the ...