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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Research of Underfill Delamination in Flip Chip by the J-Integral Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fracture mechanics approaches have been used to study reliability problems in electronic packages, in particular, adhesion related failure in flip chip assembly. It was verified in this work ...
Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal fatigue failure of SnPb solder joints of flip chip on board with and without underfill for two types of flip-chip packages was investigated by conducting thermal cycling test, ...