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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50×10−6m(50μm) deep and 200×10−6m(200μm) ...