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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Analytical and Experimental Characterization of Bonding Over Active Circuitry
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Placing active circuitry directly underneath the bond pads is an effective way to reduce the die size, and hence to achieve lower cost per chip. The main concern with such design is the ...