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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Numerical predictive accuracy is assessed for component-printed circuit board (PCB) heat transfer in forced convection using a computational fluid dynamics (CFD) software for the thermal analysis ...
An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Numerical predictive accuracy is assessed for component-printed circuit board (PCB) heat transfer in forced convection using a widely used computational fluid dynamics (CFD) software. In Part I ...