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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The flow modeling approaches employed in computational fluid dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are generally not specific for the analysis of forced ...