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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: It is essential for electronics reliability to develop effective methodologies to detect hidden solder joint defects. Active infrared thermography is an alternative to Xray detection methodologies. The limits of active ...