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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The phosphor and die bonding configuration affect the optical efficiency and thermal performance in phosphor-coated white light emitting diodes (LEDs). In this paper, light emission studies reveal that the chromaticity ...