Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Flow and Heat Transfer Analysis of an Electro Osmotic Flow Micropump for Chip Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper reports theoretical and numerical analysis of fluid flow and heat transfer in a cascade electroosmotic flow (EOF) micropump for chip cooling. A simple analytical model is developed to determine the temperature ...