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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The need for compact models for ICs is a well-recognized problem in electronics cooling simulations of systems containing multiple PCBs and many devices per board. The disparate length scales ...