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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Silver Flip-Chip Technology by Solid-State Bonding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silver flip-chip joints between silicon (Si) chips and copper (Cu) substrates were fabricated using a solid-state bonding process without any solder and without flux. The bonding process was ...
Direct Silver to Copper Bonding Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A novel process of bonding silver (Ag) foils to copper (Cu) substrates has been developed. This direct bonding method does not use any intermediate layer in between. An important application ...
Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold ...