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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Enhanced Heat Transfer Using Microporous Copper Inverse Opals
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Enhanced boiling is one of the popular cooling schemes in thermal management due to its superior heat transfer characteristics. This study demonstrates the ability of copper inverse opal (CIO) porous structures to enhance ...