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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Experimental Investigation of the Formation of Surface Mount Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As part of a major project to develop a computer-based model to support the product and process design activity for reflow soldered assemblies, it has been found necessary to carry out ...
Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The wettability of PCB pads and component terminations, and the variation of wetta-bility with time, are important factors in the successful formation of a solder joint. However, reliable ...