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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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An Evaluation of Gold and Copper Wire Bonds on Shear and Pull Testing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In microelectronic packaging technology wire bonding is a common interconnect technique. The quality and reliability of wire bonds are generally evaluated by ball shear and stitch pull testing. ...