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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solutions for axisymmetric profiles of solder joints formed between a cylindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation ...