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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The use of PBGA (plastic ball grid array) electronic packages has been greatly increased in the last decade due to high I/O densities offered. The fatigue life prediction for them is a ...
Effective Local Flexural Stiffness of Ball Grid Array Assemblies
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Parts on the circuit board serve as reinforcements and produce local stiffness, which influences the deflection of the assembly under vibration. The curvature of the circuit board, combined with ...