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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Effect of Through Silicon Via Joule Heating on Device Performance for Low Powered Mobile Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Threedimensional (3D) throughsiliconvia (TSV) technology is emerging as a powerful technology to reduce package footprint, decrease interconnection power, higher frequencies, and provide efficient integration of heterogeneous ...