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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A reliability model is established to study thermal fatigue behavior of solder joints in plastic ball grid array (PBGA) assemblies. The model is able to simulate a configuration with a large ...