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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The work is aimed to investigate the mechanical responses of bare dies of the combination of pure tin∕Al–NiV–Cu Under bump metallization (UBM) and packages of pure tin∕Al–NiV–Cu UBM/substrate ...