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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Reliability Assessment of Wafer Level Packages With Novel FeNi Under Bump Metallization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: FeNi alloy is considered a possible substitute for Cu as under bump metallization (UBM) in wafer level package (WLP) since it forms very thin intermetallic compound (IMC) layer with Pbfree solder in the reflow process. In ...