Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: One of the most important issues whether anisotropic conductive film (ACF) interconnection technology is suitable to be used for flip chip on organic board applications is thermal cycling ...
Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Reliability of epoxy molding compounds used in plastic packages of integrated circuit (IC) devices depends to a great extent on the level of thermal stresses. These are due primarily to the ...
Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Moisture poses a significant threat to the reliability of microelectronic assemblies and can be attributed as being the principal cause of many premature package failures. Of particular concern ...