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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Board Level Drop Test Analysis Based on Modal Test and Simulation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder joint reliability in drop test is crucial for handheld systems, such as mobile phone, digital camera, and MP3 player. In recent years, a lot of experiments and simulations have been ...
Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Dynamic properties of printed circuit board (PCB) assembly under drop impact are investigated when viscoelasticity of substrate materials is considered. The main materials of a PCB substrate are ...