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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This research focused on extending the applications of fused deposition modeling (FDM) by extrusion and deposition of low melting temperature metal alloys to create threedimensional metal structures and singlelayer contacts ...