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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes the use of the double cantilever beam (DCB) method for characterizing the adhesion strength of interfaces in advanced microelectronic packages at room and high temperatures. Those interfaces include ...