Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Analysis of Solderless Press-Fit Interconnections During the Assembly Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper deals with typical mechanical problems that are encountered in a solderless press-fit assembly process. First, the elastic-plastic properties of two types of press-fit pins and the ...