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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Fatigue Life Analysis of Solder Joints in Flip Chip Bonding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes the life assessment of flip chip joints. Flip chip joints of 63Sn-37Pb and 5Sn-95Pb solders on a printed circuit board were stressed thermally for fatigue. Fatigue lives ...
Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes the tensile strength and inelastic constitutive relationship of six types of Sn-Pb solders. Static tension tests were carried using 5Sn-95Pb, 10Sn-90Pb, 40Sn-60Pb, 60Sn-40Pb, ...