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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As the shrinkage and integration of devices, the creep behavior of tin-based alloys becomes important with microscales. In this paper, the behavior of creep deformation in solder alloys during ...
Reliability Evaluation on Deterioration of Power Device Using Coupled Electrical-Thermal-Mechanical Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a simulation method to evaluate the thermal fatigue life of a power module. A coupled electrical-thermal analysis was performed to obtain the nonuniform temperature distribution ...