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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Robust precision temperature control of heat-dissipating photonics components is achieved by mounting them on thermoelectric modules (TEMs), which are in turn mounted on heat sinks. However, the ...
Efficient Cooling of Multiple Components in a Shielded Circuit Pack
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We describe a technology in which multiple components inside a circuit pack shielded from electromagnetic interference (EMI) are efficiently cooled by individual heat sinks that protrude into an ...