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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. ...