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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increasing heat densities in electronic components and focus on energy efficiency have motivated utilization of embedded two-phase cooling, which reduces system-level thermal resistance and pumping power. To achieve ...