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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Experiment and Numerical Analysis of the Residual Stresses in Underfill Resins for Flip Chip Package Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package ...