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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Prediction of Solder Joint Geometries in Array-Type Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An approximate mathematical model is developed for predicting the shapes of solder joints in an array-type interconnect (e.g., a ball-grid array or flip-chip interconnect). The model is based ...