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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper describes mechanical means for enhancing the adhesion between the epoxy molding compound and the die and die pad in plastic packages. By introducing patterns of holes and slots along ...