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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Transient Response of Microchannel Heat Sinks in a Silicon Wafer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The transient conjugated heat transfer in forced convection for simultaneously developing laminar flow inside a microchannel heat sink is studied by solving the steady momentum equation and the ...