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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A unified constitutive model for polymer films is proposed with viscoelastic characterization at small deformation and viscoplastic characterization at large deformation based on molecular chain ...
Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermomechanical behaviors of a new lead free solder and eutectic 63Sn37Pb are investigated in this paper. A series of tests including tensile, creep, and fatigue, are carried out on a ...