Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The present study examines the thermomechanical strain-rate sensitivity of eutectic 63Sn–37Pb solder over a broad range of strain-rates from 0.0002 s–1 to 200 s–1 , thus encompassing failure ...