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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the literature, the local-global finite element analysis technique plays a very important role in the area array packaging. In this study, the underlying goal is to propose an improved ...