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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lead compliance is a critical parameter in optimal design and interconnection reliability of surface mount leaded components. The cyclic force transmitted to the solder joint in surface mount ...
Fatigue Analysis of a Planarpak™ Surface Mount Component
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper discusses the thermo-mechanical fatigue life analysis of an analog Avantek Planarpak™ surface mount device where the entire base of the component is soldered directly to the printed ...