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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Thermal Characterization of Heat Sink Adhesive Systems for Spacecraft Electronics by Time-Resolved Infrared Radiometry
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A new thermal characterization technique, time-resolved infrared radiometry (TRIR), is used to investigate three different heat sink adhesive systems used in spacecraft electronics - a filled ...