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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Effect of Polarity on Heat Transfer in the Ball Formation Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Ball formation is the first step in wire bonding of semiconductor chips to their lead frames. An electric discharge melts the wire and surface tension causes the melt to roll up into a ball; ...
Heat Transfer in Wire Bonding Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We have analyzed an electric discharge between wire and planar electrodes with wire diameter and current densities that are typically used in upscaled experimental simulations of the wire bonding ...
Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: During normal power cycling of the electronic equipment, the differing coefficients of thermal expansion result in differential elongations. Because each level of packaging is subject to mounting ...